Sputtering is a common technology that is widely used for thin film manufacturing.
Sputtering is a process whereby particles are ejected from a solid target material due to bombardment of the target by energetic particles, particualarly, in the laboratory, gas ions. Happens when kinetic energy of the incoming particles is much higher than the conventional thermal energies.
We offer a variety of sputtering materials in various compositions. Available in different thicknesses as per your specifications, for both R&D and production proceesses.
Our sputtering targets are up to 99.999% pure. With capabilities up to 16” diameter and 20” in length, we stock the most common sizes of stoichiometry. Rotable targets, used for large area depositions, are available up to 1,000 mm in length.
Also, pellets, rods, pieces, granules, slugs, ingots shot and deposition cones are available.
Our sputtering targets are made from oxides, metallics, and alloys, they are produced in a variety of shapes and sizes, including the following:
• Custom Shape
• Triangular Planer